Method for manufacturing a composite arrangement

In a method for manufacturing a composite arrangement, at least one printed circuit board substrate is joined with a support under the influence of an applied pressure exerted by a press die over a weave layer (prepreg) impregnated with resin, such that the resin in the region of an opening of the p...

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Bibliographische Detailangaben
Hauptverfasser:	WIESA, THOMAS, SCHIMITZEK, RALPH, WAGENBRENNER, WALTER
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	In a method for manufacturing a composite arrangement, at least one printed circuit board substrate is joined with a support under the influence of an applied pressure exerted by a press die over a weave layer (prepreg) impregnated with resin, such that the resin in the region of an opening of the printed circuit board substrate does not flow into this opening. The applied pressure is, therefore, at least partially reduced in the region of the opening of the printed circuit board substrate.