Method and device for mechanically removing solder beads on the surface of the printed circuit boards

The invention relates to a method for mechanically removing solder beads (14) from the surface of printed circuit boards (10) directly after they pass through the solder flow during flow soldering of printed circuit boards in a soldering plant. In order to ensure that the solder beads are mechanical...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SCHWINN, TILMAN, LUCHT, HEINZ-OLAF, TAUCHMANN, JENS
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The invention relates to a method for mechanically removing solder beads (14) from the surface of printed circuit boards (10) directly after they pass through the solder flow during flow soldering of printed circuit boards in a soldering plant. In order to ensure that the solder beads are mechanically removed without damaging the printed circuit boards, the solder beads (14) are mechanically removed by means of at least one jet (50) of cold gas directed onto the surface.