Method and apparatus for modifying circuit having ball grid array interconnections

In aspect, the present invention is directed to a pad connector including a substantially flat pad portion, and a tail portion having a top portion attached to the pad portion and a bottom portion. The tail portion is angulated with respect to the pad portion. In another aspect, the present inventio...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	STINEMIRE, ROGER A, CHARTRAND, RICHARD L, MA, WAI-MON
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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Beschreibung
Zusammenfassung:	In aspect, the present invention is directed to a pad connector including a substantially flat pad portion, and a tail portion having a top portion attached to the pad portion and a bottom portion. The tail portion is angulated with respect to the pad portion. In another aspect, the present invention is directed to a method of modifying a circuit board having at least one Ball Grid Array (BGA). The method includes removing the via portion of the BGA pad from the circuit board to sever the connection between the via and the circuit, attaching the pad connector to the circuit board, and connecting the pad connector to the circuit of the circuit board.