Four transistor SRAM cell

A device structure comprising a resistor in a via opening between adjacent levels of metallization of a conventional field effect transistor (FET) by disposing amorphous ( alpha ) silicon between metal barrier layers, such as titanium tungsten and titanium nitride, at the via opening which is filled...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KLEIN, RICHARD K
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A device structure comprising a resistor in a via opening between adjacent levels of metallization of a conventional field effect transistor (FET) by disposing amorphous ( alpha ) silicon between metal barrier layers, such as titanium tungsten and titanium nitride, at the via opening which is filled with a conductive material, such as tungsten, the device structure enabling a conventional FET and the resistor to only take the space of a conventional FET due to the unique properties of alpha -silicon.