Tool for removing protective encapsulants

A system for removing protective coatings from a circuit board assembly. The system includes a tool for removing protective coatings from a circuit board assembly. The tool has a flow head, which includes a support, having an opening which is adapted to contact the circuit board assembly and flow so...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	STEPHANIE, JOHN GREGORY, SWAIN, MILES FRANK
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLEANING CLEANING IN GENERAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL PRINTED CIRCUITS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	A system for removing protective coatings from a circuit board assembly. The system includes a tool for removing protective coatings from a circuit board assembly. The tool has a flow head, which includes a support, having an opening which is adapted to contact the circuit board assembly and flow solvent to the surface of the circuit board. The flow head may also include a solvent nozzle positioned within the support. The solvent nozzle has an opening adapted to apply solvent to the circuit board assembly. The flow head also includes a solvent recovery volume positioned beneath the support and adjacent to the nozzle. The system also includes a second solvent reservoir, a mechanism for applying heat to the reservoir, and a mechanism for circulating solvent from the reservoir to the flow head and back to the reservoir.