Copper-tungsten alloys and their manufacturing methods

PCT No. PCT/JP96/00080 Sec. 371 Date Dec. 23, 1996 Sec. 102(e) Date Dec. 23, 1996 PCT Filed Jan. 19, 1996 PCT Pub. No. WO96/22401 PCT Pub. Date Jul. 25, 1996Copper-tungsten alloys used for materials of electrode, electric contacts, package materials for semiconductors, heat sink and their manufactur...

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Hauptverfasser:	NAKADA, KIMIO, YAMABE, HIROYUKI, NAKAYAMA, MASAO, AKIYOSHI, NAOYOSHI, KODA, KATSUMI
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS CASTING CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC SWITCHES ELECTRICITY EMERGENCY PROTECTIVE DEVICES FERROUS OR NON-FERROUS ALLOYS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METALLURGY PERFORMING OPERATIONS POWDER METALLURGY RELAYS SELECTORS SEMICONDUCTOR DEVICES TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WORKING METALLIC POWDER
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Zusammenfassung:	PCT No. PCT/JP96/00080 Sec. 371 Date Dec. 23, 1996 Sec. 102(e) Date Dec. 23, 1996 PCT Filed Jan. 19, 1996 PCT Pub. No. WO96/22401 PCT Pub. Date Jul. 25, 1996Copper-tungsten alloys used for materials of electrode, electric contacts, package materials for semiconductors, heat sink and their manufacturing methods. The copper-tungsten alloy contains preferably 5 to 30 wt. % of copper, 0.002 to 0.04 wt. % of phosphor, the remaining portion being substantially all tungsten, and it is preferable to contain in these alloys 0.1 to 0.5% of cobalt, nickel or iron or else any combined two out of these three.