Organosiloxane compositions yielding cured products exhibiting adhesion and reduced flammability

The combination of reduced flammability and adhesion can be imparted to cured organosiloxane materials when the curable compositions used to prepare these materials contain 1) an adhesion promoting composition comprising up to about 0.1 weight percent, based on the weight of the curable composition,...

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Bibliographische Detailangaben
Hauptverfasser:	SIERAWSKI, DAVID ALAN, WILSON, STEVEN WEST, WITUCKI, BETH ANN
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The combination of reduced flammability and adhesion can be imparted to cured organosiloxane materials when the curable compositions used to prepare these materials contain 1) an adhesion promoting composition comprising up to about 0.1 weight percent, based on the weight of the curable composition, of a chelated organoaluminum compound in combination with an organic epoxide compound and an alkoxysilane or condensation product of the silane, and 2) as a flame-retarding additive, hydrated aluminum oxide and/or magnesium hydroxide, preferably in combination with additional fillers such as quartz.