Apparatus and method for rapid thermal processing

A closable enclosure for rapid thermal processing of semiconductor wafers is presented, wherein the closable enclosure has an enclosed volume less than 10 times the volume of the wafer, and wherein the closable enclosure may be closed about the wafer while the closable enclosure is surrounded by the...

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Bibliographische Detailangaben
Hauptverfasser: SOMMER, HELMUT, KALTENBRUNNER, GUENTER, NENYEI, ZSOLT
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A closable enclosure for rapid thermal processing of semiconductor wafers is presented, wherein the closable enclosure has an enclosed volume less than 10 times the volume of the wafer, and wherein the closable enclosure may be closed about the wafer while the closable enclosure is surrounded by the process gas.