Measuring deposit thickness in composite materials production

This invention relates to novel apparatuses for measuring deposit thickness during composite materials production. More particularly, this invention uses a composite's emission signature or a composite's reflectance signature, to measure deposit thickness.

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Bibliographische Detailangaben
Hauptverfasser:	LILLQUIST, ROBERT DAVID, SAVKAR, SUDHIR DATTATRAYA, MILLER, RUSSELL SCOTT
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS METALLURGY PHYSICS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TESTING
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Beschreibung
Zusammenfassung:	This invention relates to novel apparatuses for measuring deposit thickness during composite materials production. More particularly, this invention uses a composite's emission signature or a composite's reflectance signature, to measure deposit thickness.