Process for throughplating printed circuit boards using conductive plastics

The invention pertains to a process for throughplating of printed circuit boards using conductive plastics for direct plating, wherein a polymer film with intrinsic electric conductivity is adhesively deposited on non-conductive areas of the printed circuit boards, whereupon a metal film is applied....

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Bibliographische Detailangaben
Hauptverfasser:	STUCKMANN, WALTER, ROESCH, GERHARD
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CONDUCTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
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Beschreibung
Zusammenfassung:	The invention pertains to a process for throughplating of printed circuit boards using conductive plastics for direct plating, wherein a polymer film with intrinsic electric conductivity is adhesively deposited on non-conductive areas of the printed circuit boards, whereupon a metal film is applied. Selective production of the polymer film has previously been seen as requiring an oxidative pre-treatment of the printed circuit board, though this can negatively affect the further course of the process. With the present invention the potential negative effects are avoided by forgoing the oxidation pre-treatment.