Low voltage electrostatic clamp for substrates such as dielectric substrates

An electrostatic clamp for dielectric substrates is operated with a low voltage electric source by reducing the width of electrode lines to less than 100 mu m and by reducing the spacing between adjacent electrode lines to less than 100 mu m. The electrostatic clamp includes an array of electrodes such as aluminum formed on a base of insulating material such as glass and covered by an insulating layer such as nitride which covers and protects the electrodes. Electrical contacts apply voltages of opposite polarities to alternating electrode lines to create a non-uniform electric field which causes a dielectric substrate to be pulled toward the region of highest electric field. The reduced width electrode lines and spacings are created by the use of micro-lithographic techniques including thin film deposition and etching for formation of the electrode and the coating layers.