Laser texturing apparatus with dual laser paths having an independently adjusted parameter

A disk texturing process uses a single pulsed laser to texture disks within a first group, which are carried through the texturing process on a first spindle assembly, and from a second group, which are carried through the texturing process on a second spindle assembly. Preferably, disks from the fi...

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Bibliographische Detailangaben
Hauptverfasser:	LISANKE, MICHAEL GERARD, TAHERI, ALI REZA, CHRUSCH, PETER P, PENA, LANPHUONG THI, BARENBOIM, MICHAEL, KERSTENS, PIETER J. M, SCHNETZER, ERIC V, HARPER, BENNY MICHAEL, SEING, HONG S, BAUMGART, PETER MICHAEL, LU, HUIZONG, TAM, ANDREW CHING, KAMI, BENJAMIN
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PHYSICS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A disk texturing process uses a single pulsed laser to texture disks within a first group, which are carried through the texturing process on a first spindle assembly, and from a second group, which are carried through the texturing process on a second spindle assembly. Preferably, disks from the first group are textured alternately with disks in the second group. A first level of least one texturing parameter is stored for use only as the process is applied to disks from the first group, while a second level of the same texturing parameter is stored for use only as the process is applied to disks from the second group. These levels may be derived from measurements of textured spots made with interferometric devices forming portions of a texturing station.