Reduced output test configuration for tape automated bonding

An integrated circuit assembly using tape automated bonding (TAB) reduces the number of TAB test pads formed upon the TAB film, for purposes of testing the integrated circuit prior to surface mounting, by sharing at least some of such test pads between at least two output terminals of the integrated...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KOZICEK, JAMES RICHARD, FULLMAN, EDWARD CARL, ERHART, RICHARD ALEXANDER, NELSON, RICHARD BRIAN
Format:	Patent
Sprache:	eng
Schlagworte:	MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS TESTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!