Reduced output test configuration for tape automated bonding

An integrated circuit assembly using tape automated bonding (TAB) reduces the number of TAB test pads formed upon the TAB film, for purposes of testing the integrated circuit prior to surface mounting, by sharing at least some of such test pads between at least two output terminals of the integrated circuit. A control signal indicates to the integrated circuit that a TAB test mode of operation is in effect. A second control signal indicates which of the two output signals should be enabled to the shared test pad during the TAB test mode. Multiplexers are provided at the output terminals, and are responsive to such control signals, for selectively allowing one of such output signals to be conducted to the test pad, while temporarily presenting a high impedance at the other output terminal. A method of testing such integrated circuit assembly includes the step of trimming such test pads from the tape automated bonding film after testing and before surface mounting.