Mounting assembly for electrical components and heat sinks

A mounting assembly mounts an integrated circuit between a printed circuit board and a lower surface of a heat sink. The mounting assembly includes a plurality of electrical leads extending out from the integrated circuit and toward the printed circuit board. The electrical leads extend in a directi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HODGES, FRANK, JACKSON, KURT R, GLOVER, ALFRED H, MACH, TERRY P, DAVE, CHANDRAKANT, MORRIS, STEPHEN L
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A mounting assembly mounts an integrated circuit between a printed circuit board and a lower surface of a heat sink. The mounting assembly includes a plurality of electrical leads extending out from the integrated circuit and toward the printed circuit board. The electrical leads extend in a direction away from the lower surface of the heat sink. A spring is secured to the heat sink and disposed adjacent the printed circuit board and facing the integrated circuit to abut the lower surface of the heat sink such that thermal energy will pass from the integrated circuit to the heat sink.