Modular assembly including two electronic circuits to be electrically interconnected to convey a microwave signal

The invention relates to a modular assembly comprising at least two modules to be assembled together and to be electrically interconnected when assembled for the purpose of conveying a microwave signal from an electronic circuit of one of the modules to an electronic circuit of the other module, sai...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SEMO, JACK, TANNIOU, JACQUES, KALONJI, NDIATA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DEVICES USING STIMULATED EMISSION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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