Modular assembly including two electronic circuits to be electrically interconnected to convey a microwave signal

The invention relates to a modular assembly comprising at least two modules to be assembled together and to be electrically interconnected when assembled for the purpose of conveying a microwave signal from an electronic circuit of one of the modules to an electronic circuit of the other module, said electronic circuits being disposed in respective packages. One of said electronic circuits includes at least one opto-electronic component that is optically connected to at least one optical fiber. Both packages are adapted to receive a microwave feedthrough having a central conductor whose axial ends come into contact with conductive tracks belonging to each of said electronic circuits, respectively.