Modular assembly including two electronic circuits to be electrically interconnected to convey a microwave signal

Modular assembly including two electronic circuits to be electrically interconnected to convey a microwave signal

The invention relates to a modular assembly comprising at least two modules to be assembled together and to be electrically interconnected when assembled for the purpose of conveying a microwave signal from an electronic circuit of one of the modules to an electronic circuit of the other module, sai...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SEMO, JACK, TANNIOU, JACQUES, KALONJI, NDIATA
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator SEMO
JACK
TANNIOU
JACQUES
KALONJI
NDIATA
description The invention relates to a modular assembly comprising at least two modules to be assembled together and to be electrically interconnected when assembled for the purpose of conveying a microwave signal from an electronic circuit of one of the modules to an electronic circuit of the other module, said electronic circuits being disposed in respective packages. One of said electronic circuits includes at least one opto-electronic component that is optically connected to at least one optical fiber. Both packages are adapted to receive a microwave feedthrough having a central conductor whose axial ends come into contact with conductive tracks belonging to each of said electronic circuits, respectively.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US5808530A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US5808530A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US5808530A3</originalsourceid><addsrcrecordid>eNqFi8EKglAQRd20iOobmh8IBBHcRhRtWlVrGcdJBsY39t5T8e-zcN_qcu85d528b1b3ih4wBG4rnUAcaV-LayCOBqxM0ZsTAhJPvcQA0aDihQih_k6RPZlz88b115jLwBMgtELeRhwYgjQOdZusXqiBd0tukv3l_DhdD9xZyaFDYsexfN7zIi3yLD1m_40PHqFD9A</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Modular assembly including two electronic circuits to be electrically interconnected to convey a microwave signal</title><source>esp@cenet</source><creator>SEMO; JACK ; TANNIOU; JACQUES ; KALONJI; NDIATA</creator><creatorcontrib>SEMO; JACK ; TANNIOU; JACQUES ; KALONJI; NDIATA</creatorcontrib><description>The invention relates to a modular assembly comprising at least two modules to be assembled together and to be electrically interconnected when assembled for the purpose of conveying a microwave signal from an electronic circuit of one of the modules to an electronic circuit of the other module, said electronic circuits being disposed in respective packages. One of said electronic circuits includes at least one opto-electronic component that is optically connected to at least one optical fiber. Both packages are adapted to receive a microwave feedthrough having a central conductor whose axial ends come into contact with conductive tracks belonging to each of said electronic circuits, respectively.</description><edition>6</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; DEVICES USING STIMULATED EMISSION ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>1998</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19980915&amp;DB=EPODOC&amp;CC=US&amp;NR=5808530A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19980915&amp;DB=EPODOC&amp;CC=US&amp;NR=5808530A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SEMO; JACK</creatorcontrib><creatorcontrib>TANNIOU; JACQUES</creatorcontrib><creatorcontrib>KALONJI; NDIATA</creatorcontrib><title>Modular assembly including two electronic circuits to be electrically interconnected to convey a microwave signal</title><description>The invention relates to a modular assembly comprising at least two modules to be assembled together and to be electrically interconnected when assembled for the purpose of conveying a microwave signal from an electronic circuit of one of the modules to an electronic circuit of the other module, said electronic circuits being disposed in respective packages. One of said electronic circuits includes at least one opto-electronic component that is optically connected to at least one optical fiber. Both packages are adapted to receive a microwave feedthrough having a central conductor whose axial ends come into contact with conductive tracks belonging to each of said electronic circuits, respectively.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DEVICES USING STIMULATED EMISSION</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1998</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqFi8EKglAQRd20iOobmh8IBBHcRhRtWlVrGcdJBsY39t5T8e-zcN_qcu85d528b1b3ih4wBG4rnUAcaV-LayCOBqxM0ZsTAhJPvcQA0aDihQih_k6RPZlz88b115jLwBMgtELeRhwYgjQOdZusXqiBd0tukv3l_DhdD9xZyaFDYsexfN7zIi3yLD1m_40PHqFD9A</recordid><startdate>19980915</startdate><enddate>19980915</enddate><creator>SEMO; JACK</creator><creator>TANNIOU; JACQUES</creator><creator>KALONJI; NDIATA</creator><scope>EVB</scope></search><sort><creationdate>19980915</creationdate><title>Modular assembly including two electronic circuits to be electrically interconnected to convey a microwave signal</title><author>SEMO; JACK ; TANNIOU; JACQUES ; KALONJI; NDIATA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US5808530A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1998</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DEVICES USING STIMULATED EMISSION</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>SEMO; JACK</creatorcontrib><creatorcontrib>TANNIOU; JACQUES</creatorcontrib><creatorcontrib>KALONJI; NDIATA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SEMO; JACK</au><au>TANNIOU; JACQUES</au><au>KALONJI; NDIATA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Modular assembly including two electronic circuits to be electrically interconnected to convey a microwave signal</title><date>1998-09-15</date><risdate>1998</risdate><abstract>The invention relates to a modular assembly comprising at least two modules to be assembled together and to be electrically interconnected when assembled for the purpose of conveying a microwave signal from an electronic circuit of one of the modules to an electronic circuit of the other module, said electronic circuits being disposed in respective packages. One of said electronic circuits includes at least one opto-electronic component that is optically connected to at least one optical fiber. Both packages are adapted to receive a microwave feedthrough having a central conductor whose axial ends come into contact with conductive tracks belonging to each of said electronic circuits, respectively.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US5808530A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Modular assembly including two electronic circuits to be electrically interconnected to convey a microwave signal
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-01T05%3A37%3A15IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SEMO;%20JACK&rft.date=1998-09-15&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS5808530A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true