Bent lead repair tool for electronic components

An apparatus and method for straightening bent leads for an electrical component having a tiebar attached to the distal end of the component leads includes a repair surface with a repair stage mounted thereon. The repair stage has a series of combs projecting therefrom and defining a series of recesses there between. The recesses conform to the lead pattern of the component. A cutout is located along an edge of the repair stage, terminating a recess. An alignment means is also mounted to the repair surface and located relative to the cutout such that a form punch can be inserted into the aligning means and into the cutout. The bent lead of the component is positioned on the repair stage with the tiebar against the edge of the repair stage having the cutout disposed thereon. As the form punch enters the cutout the bent lead is also forced into the cutout thus pulling the remainder of the lead into the recess terminated by the cutout and straightening the remainder of the lead. The bent portion of the lead is now located proximate the tiebar such that the bent portion of the lead can be removed when the tiebar is removed from the component for installation of the component.