Device for testing integrated circuit chips during vibration

The invention includes a testing apparatus for testing integrated circuit chips during vibration. The apparatus includes a vibration fixture base which is a table that can be vibrated vertically and/or horizontally. The base supports a holding fixture for supporting a flexible circuit having circuit traces whose ends terminate in raised dots or bumps. The flexible circuit is clamped to the holding fixture to properly position the raised features at the end of the circuit traces. A holder and clamp unit holds a plurality of integrated circuit chips and clamps the chips against the bumps on the flexible circuit with predetermined pressure to make electrical contact between pads on the integrated circuit chip and the bumps. The clamp unit can be raised and lower and rotated. Even pressure is assured by a compressible layer carried in the fixture and located beneath the bumps. The contact points of the bumps and the integrated circuit chip pads vibrate in unison during vibration testing. Firm clamping pressure provided by the compressible layer and the clamp eliminates damage to the chip under vibration testing.