Semiconductor wafer contact system and method for contacting a semiconductor wafer
A semiconductor wafer contact system includes a sealed bladder (32) containing incompressible material. The sealed bladder (32) presses against a flexible circuit layer (28) including an array of electrical contacts (30). The bladder (32) forces the array of electrical contacts (30) against a corres...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A semiconductor wafer contact system includes a sealed bladder (32) containing incompressible material. The sealed bladder (32) presses against a flexible circuit layer (28) including an array of electrical contacts (30). The bladder (32) forces the array of electrical contacts (30) against a corresponding array of device electrical contacts (12) on die (11) of a semiconductor wafer (10). The bladder (32) adapts in shape to compensate for die level and wafer level irregularities in contact height and non-parallelism. Additionally, bladder (32) ensures a constant force between membrane contacts (30) and die contacts (12), across the entire wafer (10). |
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