On the use of non-spherical carriers for substrate chemi-mechanical polishing

A substrate holder assembly for immobilizing an integrated circuit (IC) wafer during polishing is described. The substrate holder includes a base plate sized to support the integrated circuit (IC) wafer, a circumferential restraint member arranged with respect to the base plate to engage the IC wafe...

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Bibliographische Detailangaben
Hauptverfasser:	HEINE, DAVID J, CRAMER, JAYASHREE KALPATHY, PASCH, NICHOLAS F
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	A substrate holder assembly for immobilizing an integrated circuit (IC) wafer during polishing is described. The substrate holder includes a base plate sized to support the integrated circuit (IC) wafer, a circumferential restraint member arranged with respect to the base plate to engage the IC wafer's edges and a carrier assembly disposed above the base plate and below the IC wafer. The carrier assembly includes a film having a surface that is characterized by a substantially oblate spheroid or hyperboloid surface of rotation, wherein the surface of the film is capable of supporting the IC wafer in a manner causing the IC wafer to bow according to the surface of rotation.