Carrying device for electroplating and method for improving the delivery of current therein

A carrying device for electroplating and method for improving the delivery of current therein. The carrying device comprises a core of a high conductivity material and a cladding shrunk around and sealing the core, the cladding having a second, moderate conductivity material which, however, has a high resistance to acidic corrosion. The device further comprises a plurality of electrically conductive clamping members of the second material for clamping an article to be electroplated and for delivering current thereto. Current flow to the clamping members is improved by respective pins consisting essentially of the second material, the pins being forced into respective undersized apertures provided near the clamping members.