Encapsulated electronic component having a plurality of connection leads of martensitic structural-hardening conductive alloy

An encapsulated electronic component containing a plurality of connection leads and an outer case, where the connection leads extend externally to the outer case and contain martensitic structural-hardening conductive alloy.

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Bibliographische Detailangaben
Hauptverfasser: REYAL, JEAN-PIERRE, COZAR, RICARDO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:An encapsulated electronic component containing a plurality of connection leads and an outer case, where the connection leads extend externally to the outer case and contain martensitic structural-hardening conductive alloy.