Encapsulated electronic component having a plurality of connection leads of martensitic structural-hardening conductive alloy
An encapsulated electronic component containing a plurality of connection leads and an outer case, where the connection leads extend externally to the outer case and contain martensitic structural-hardening conductive alloy.
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | An encapsulated electronic component containing a plurality of connection leads and an outer case, where the connection leads extend externally to the outer case and contain martensitic structural-hardening conductive alloy. |
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