Deformable interconnect structure for connecting an internal plane to a through-hole in a multilayer circuit board

A novel through-hole interconnect for connecting a power plane conductor to a through-hole includes a central pad connected to the through-hole and a deformable hinge that connects the central pad with the power plane conductor in a multilayer circuit board. The central pad and hinge are defined by a non-continuous area removed from the plane conductor. Preferably this area has a C-shape. During the compression process to join the core assemblies, deformation of the hinge advantageously absorbs the shear forces and allows the power plane beyond the hinge to remain substantially planar. The resulting multilayer laminated circuit board includes a plurality of cores laminated together in a stacked configuration and a plurality of plated through-holes defined in said multilayer laminated circuit board each of which is connected to a plane conductor by a hinge deformed so that the interconnect area is aligned outside of a plane defined by the plane conductor. The hinged interconnect avoids shearing problems and thereby improves the reliability of the connection between the through-hole and the power plane, increasing the manufacturing yield and reducing costs. Furthermore, the hinged interconnect minimizes or eliminates internal plane distortion over the signal lines because the reference plane deformation is localized and the signal lines lie substantially outside the area of localized deformation and therefore the impedance seen by the signal lines is substantially unaffected by the compression-induced deformation.