Electromagnetic interference resistant enclosure panel and method of making [the same]

Electromagnetic interference across a structural panel is minimized in a construction wherein a metal skin (24) is bonded to a metal frame (22) by an adhesive (40) by providing a series of peaks (36) and valleys (38) at the area of the intended joint between the skin (24) and the frame (22). The pea...

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Bibliographische Detailangaben
Hauptverfasser:	CASE, PAUL, MAULE, ROBERT S, STANULIS, DONALD, BAMBERG, RICHARD A, STURGILL, W. JEFFREY
Format:	Patent
Sprache:	eng
Schlagworte:	BUILDING BUILDING MATERIALS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FIXED CONSTRUCTIONS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS STRUCTURAL ELEMENTS
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Beschreibung
Zusammenfassung:	Electromagnetic interference across a structural panel is minimized in a construction wherein a metal skin (24) is bonded to a metal frame (22) by an adhesive (40) by providing a series of peaks (36) and valleys (38) at the area of the intended joint between the skin (24) and the frame (22). The peaks (36) penetrate through the adhesive (40) to establish substantial electrical contact between the skin (24) and the frame (22) to provide shielding against electromagnetic interference while the adhesive (40) bonds the two together to provide a structurally sound panel.