Silicon chip for use in a force-detection sensor

PCT No. PCT/DE92/00870 Sec. 371 Date May 10, 1994 Sec. 102(e) Date May 10, 1994 PCT Filed Oct. 16, 1992 PCT Pub. No. WO93/10430 PCT Pub. Date May 27, 1993A force sensor employing a silicon chip having a force application area on a top surface and attached to a support at a bottom surface. Piezoresis...

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Hauptverfasser:	MAREK, JIRI, BANTIEN, FRANK, HERDEN, WERNER, SCHMIDT, STEFFEN, WEIBLEN, KURT, KUESELL, MATTHIAS
Format:	Patent
Sprache:	eng
Schlagworte:	GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE PHYSICS TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS TESTING
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Zusammenfassung:	PCT No. PCT/DE92/00870 Sec. 371 Date May 10, 1994 Sec. 102(e) Date May 10, 1994 PCT Filed Oct. 16, 1992 PCT Pub. No. WO93/10430 PCT Pub. Date May 27, 1993A force sensor employing a silicon chip having a force application area on a top surface and attached to a support at a bottom surface. Piezoresistive elements are arranged on the silicon chip in areas of high mechanical tension and produce signals. Circuits, which receive the signals produced by the piezoresistive elements, are arranged on the silicon chip in areas of low mechanical tension. The areas of mechanical tension may be influenced by providing grooves and/or recesses in the bottom surface of the silicon chip and by providing grooves in the top surface of the silicon chip.