Resilient electrical interconnect

An electrical interconnect is provided for connecting an integrated circuit or other electrical or electronic component to a circuit board or for interconnecting two or more circuit boards. The interconnect comprises a substrate having one or more resilient elements of a non-conductive material and having opposite contact surfaces. A flexible conductive coating is provided on the contact surfaces of the resilient elements and extends between the contact surfaces to provide electrical connection therebetween. In one embodiment each element is integrally formed with a resilient substrate and has electrically conductive contact surfaces which are outward of the respective substrate surfaces and are electrically connected through a conductive surface which extends through vias or openings formed in the substrate. In another embodiment, each element is individually formed and is disposed within a corresponding cavity of a separate substrate. In a further embodiment, each element is individually formed having different sections of different durometers so as to provide intended spring or resilience characteristics. A particulate layer can be provided on the conductive contact surfaces to provide a roughened surface by which an oxide layer on a mating electrical contact is penetrated to minimize contact resistance.