Die carrier apparatus

Die carrier apparatus

Holder apparatus for holding an integrated circuit die for testing includes a carrier element for the die. The die is precisely located in the holder apparatus and a probe care which includes contact elements for contacting the appropriate pads on the die being tested is also secured to the holder a...

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Hauptverfasser: NORMINGTON, PETER, HIGGINS, H. DAN
Format: Patent
Sprache:eng
Schlagworte:
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
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creator NORMINGTON
PETER
HIGGINS
H. DAN
description Holder apparatus for holding an integrated circuit die for testing includes a carrier element for the die. The die is precisely located in the holder apparatus and a probe care which includes contact elements for contacting the appropriate pads on the die being tested is also secured to the holder apparatus and the card's probe needles are biased against the die. Different embodiments of the holder apparatus are disclosed, including holder apparatus with a removable alignment plate and holder apparatus with an integral alignment plate, both of which embodiments secure the die to the bottom of the holder apparatus, and holder apparatus in which the die or chip is secured to the top of the holder apparatus. Probe card apparatus usable with the various holder apparatus embodiments includes needles which comprise continuations of traces on the probe card and which include trace elements which may be connected directly to test circuitry without intermediate socket connectors.
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The die is precisely located in the holder apparatus and a probe care which includes contact elements for contacting the appropriate pads on the die being tested is also secured to the holder apparatus and the card's probe needles are biased against the die. Different embodiments of the holder apparatus are disclosed, including holder apparatus with a removable alignment plate and holder apparatus with an integral alignment plate, both of which embodiments secure the die to the bottom of the holder apparatus, and holder apparatus in which the die or chip is secured to the top of the holder apparatus. 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DAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US5589781A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1996</creationdate><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>NORMINGTON; PETER</creatorcontrib><creatorcontrib>HIGGINS; H. DAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NORMINGTON; PETER</au><au>HIGGINS; H. DAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Die carrier apparatus</title><date>1996-12-31</date><risdate>1996</risdate><abstract>Holder apparatus for holding an integrated circuit die for testing includes a carrier element for the die. The die is precisely located in the holder apparatus and a probe care which includes contact elements for contacting the appropriate pads on the die being tested is also secured to the holder apparatus and the card's probe needles are biased against the die. Different embodiments of the holder apparatus are disclosed, including holder apparatus with a removable alignment plate and holder apparatus with an integral alignment plate, both of which embodiments secure the die to the bottom of the holder apparatus, and holder apparatus in which the die or chip is secured to the top of the holder apparatus. Probe card apparatus usable with the various holder apparatus embodiments includes needles which comprise continuations of traces on the probe card and which include trace elements which may be connected directly to test circuitry without intermediate socket connectors.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record>
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subjects MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
title Die carrier apparatus
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