Die carrier apparatus

Holder apparatus for holding an integrated circuit die for testing includes a carrier element for the die. The die is precisely located in the holder apparatus and a probe care which includes contact elements for contacting the appropriate pads on the die being tested is also secured to the holder apparatus and the card's probe needles are biased against the die. Different embodiments of the holder apparatus are disclosed, including holder apparatus with a removable alignment plate and holder apparatus with an integral alignment plate, both of which embodiments secure the die to the bottom of the holder apparatus, and holder apparatus in which the die or chip is secured to the top of the holder apparatus. Probe card apparatus usable with the various holder apparatus embodiments includes needles which comprise continuations of traces on the probe card and which include trace elements which may be connected directly to test circuitry without intermediate socket connectors.