Polyimide based resin composition

A molding resin composition comprising 99.9 to 50% by weight of polyimide represented by the formula: (I) and 0.1 to 50% by weight of polyether ketone resin and/or polyester resin, and more particularly comprising the polyester resin capable of forming an anisotropical molten phase at a temperature...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MORITA, ATSUSHI, NAKAKURA, TOSHIYUKI, MORIKAWA, SHUICHI, TSUTSUMI, TOSHIHIKO, TAKAHASHI, TOSHIAKI, GOTOH, YOSHIHISA
Format: Patent
Sprache:eng
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Zusammenfassung:A molding resin composition comprising 99.9 to 50% by weight of polyimide represented by the formula: (I) and 0.1 to 50% by weight of polyether ketone resin and/or polyester resin, and more particularly comprising the polyester resin capable of forming an anisotropical molten phase at a temperature of 420 DEG C. or less, and a polyimide-based molding resin composition which comprises the said resins and other additives such as phenolic resin, fluororesin, graphite, carbon fibers, aromatic polyamide fibers, potassium titanate fibers and a crystallization accelerator, and is excellent in thermal resistance, chemical resistance, mechanical strength and processability.