Polyimide based resin composition
A molding resin composition comprising 99.9 to 50% by weight of polyimide represented by the formula: (I) and 0.1 to 50% by weight of polyether ketone resin and/or polyester resin, and more particularly comprising the polyester resin capable of forming an anisotropical molten phase at a temperature...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A molding resin composition comprising 99.9 to 50% by weight of polyimide represented by the formula: (I) and 0.1 to 50% by weight of polyether ketone resin and/or polyester resin, and more particularly comprising the polyester resin capable of forming an anisotropical molten phase at a temperature of 420 DEG C. or less, and a polyimide-based molding resin composition which comprises the said resins and other additives such as phenolic resin, fluororesin, graphite, carbon fibers, aromatic polyamide fibers, potassium titanate fibers and a crystallization accelerator, and is excellent in thermal resistance, chemical resistance, mechanical strength and processability. |
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