Polishing pad with abrasive particles in a non-porous binder

A polishing pad comprises a carrier and layer of a non-porous thermoplastic polymer secured to a surface thereof and containing a mass of discrete abrasive particles, comprising diamond or cubic boron nitride, uniformly dispersed therein. The abrasive particles have a particle size of up to 500 micr...

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Bibliographische Detailangaben
Hauptverfasser:	WRIGHT, DEREK N, SEXTON, JOHN S
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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Beschreibung
Zusammenfassung:	A polishing pad comprises a carrier and layer of a non-porous thermoplastic polymer secured to a surface thereof and containing a mass of discrete abrasive particles, comprising diamond or cubic boron nitride, uniformly dispersed therein. The abrasive particles have a particle size of up to 500 microns and are present in the layer in a concentration of up to 30 volume percent. The layer presents an abrasive polishing surface. The abrasive layer may also comprise a plurality of spaced strips secured to a surface of the carrier and each strip presents an abrasive polishing surface.