IC card rigidized cover

A cover assembly for an IC card includes top and bottom covers (52, 54) with overlapping side rails (70, 80). At each side of the card, a downwardly-extending top side rail (70) lies facewise adjacent to an upwardly extending bottom side rail (80), and a layer (90) of solder is sandwiched between th...

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Bibliographische Detailangaben
Hauptverfasser:	BETHURUM, GARY C, KNIGHTS, ANTHONY J
Format:	Patent
Sprache:	eng
Schlagworte:	BOOK COVERS BOOKBINDING CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILES HANDLING RECORD CARRIERS LOOSE LEAVES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MOVABLE-STRIP WRITING OR READING APPARATUS PERFORMING OPERATIONS PHYSICS PRESENTATION OF DATA PRINTED CIRCUITS PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR RECOGNITION OF DATA RECORD CARRIERS SPECIAL PRINTED MATTER TRANSPORTING
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Beschreibung
Zusammenfassung:	A cover assembly for an IC card includes top and bottom covers (52, 54) with overlapping side rails (70, 80). At each side of the card, a downwardly-extending top side rail (70) lies facewise adjacent to an upwardly extending bottom side rail (80), and a layer (90) of solder is sandwiched between the rails and is bonded to each of them. The solder layer extends along most of the height of each cover side, so the two rails and the solder layer between them serve as a single rigid beam. The cover assembly can be, instead, spot welded at a plurality of locations at each side of the card, to weld the two rails facewise together.