Integrated circuit package for burn-in and testing of an integrated circuit die

A method for and a disassemblable prepackage arrangement for testing and burning-in an integrated circuit die which will be hermetically sealed within and form part of an overall integrated circuit package is herein disclosed. The die has a top and bottom surface and includes a plurality of die input/output terminals. The prepackage comprises a substrate including a top surface. The bottom of the die is disengagably attached to the top surface of the substrate. A lid is disengagably attached to the substrate in a way which hermetically seals the die within a space substantially defined by the substrate and the lid. Thereafter, the die input/output terminals are electrically connecting to external testing equipment for testing and burning-in the die while the die is in a hermetically sealed environment.