Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same

Compliant electrically connection bumps for an adhesive flip chip integrated circuit device and various methods for forming the bumps include the steps of forming polymer bumps on a substrate or an integrated circuit die and coating the polymer bumps with a metallization layer. The polymer bump form...

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Bibliographische Detailangaben

Hauptverfasser:	BISHOP, THOMAS A, LEE, CHUNG J, TRAN, KIMCUC T, NOLAN, ERNEST R, HERDER, TODD H, BREEN, MARK R, DUANE, DIANA C, NELSON, RICHARD D, KESWICK, KATHRYN V, GERMAN, RANDY L, FROEHLICH, ROBERT W
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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