Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same

Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same

Compliant electrically connection bumps for an adhesive flip chip integrated circuit device and various methods for forming the bumps include the steps of forming polymer bumps on a substrate or an integrated circuit die and coating the polymer bumps with a metallization layer. The polymer bump form...

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Bibliographische Detailangaben
Hauptverfasser: BISHOP, THOMAS A, LEE, CHUNG J, TRAN, KIMCUC T, NOLAN, ERNEST R, HERDER, TODD H, BREEN, MARK R, DUANE, DIANA C, NELSON, RICHARD D, KESWICK, KATHRYN V, GERMAN, RANDY L, FROEHLICH, ROBERT W
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Zusammenfassung:Compliant electrically connection bumps for an adhesive flip chip integrated circuit device and various methods for forming the bumps include the steps of forming polymer bumps on a substrate or an integrated circuit die and coating the polymer bumps with a metallization layer. The polymer bump forming step includes the steps of coating a polymer material on a substrate, curing the polymer and the etching the bump pattern from the polymer material. The overcoating step includes electrolessly plating a ductile metal such as gold on the polymer bump.