Integrated dynamic power dissipation control system for very large scale integrated (VLSI) chips

Chip logic, a frequency multiplication and/or division, a temperature sensing circuit, and a power management circuit, are integrated on a very large scale integrated (VLSI) circuit chip. The temperature sensing circuit directly measures the chip temperature, producing a temperature output signal. The power management circuit, which is connected to the temperature sensing circuit and to the chip logic, responds to the temperature output signal and to a functional state of the chip logic to generate a control signal to the PLL. The PLL responds to the control signal to either stop the clock signal or modify the operating frequency of the clock signal, depending upon the state of the control signal.