Chip carrier for enabling production of high performance microwave semiconductor device by disposing semiconductor chip thereon

A chip carrier for a semiconductor chip, the chip having a specified thickness and lateral configuration and size. A conductive holder of the carrier has a main surface including a chip mounting surface portion for mounting the semiconductor chip thereon and a peripheral surface portion surrounding the mounting surface portion. An insulative collar member is affixed to the peripheral surface portion and has inner wall surfaces surrounding the mounting surface portion and defining a recess, of depth and lateral configuration and size dimensions respectively corresponding to those of the chip, for receiving therein and thereby positioning the chip on the conductive holder. A semiconductor chip of low mechanical strength therefore is converted for handling purposes to handling of the chip carrier, which has a high mechanical strength and facilitates easy and precise mounting of the chip on a predetermined position of a package, and which permits replacement of a defective chip without discarding the associated package.