Method and apparatus for releasing a semiconductor wafer from an electrostatic clamp

A method and apparatus is provided for effectively releasing a semiconductor wafer (36) from a deactivated electrostatic clamp (20) by diffusing a neutralizing gas into the space between the clamping surface of the electrostatic clamp and the surface of the wafer, generating an ionizing voltage with...

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Hauptverfasser: ROBBINS, ROGER A
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ROGER A
description A method and apparatus is provided for effectively releasing a semiconductor wafer (36) from a deactivated electrostatic clamp (20) by diffusing a neutralizing gas into the space between the clamping surface of the electrostatic clamp and the surface of the wafer, generating an ionizing voltage with an alternating polarity, and applying the alternating polarity ionizing voltage to the diffusing gas to neutralize the residual electrostatic charges remaining on the surfaces of the clamp (20) and the wafer (36).
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subjects BASIC ELECTRIC ELEMENTS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERATION
HAND TOOLS
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
MANIPULATORS
METALLURGY
NATURALLY-OCCURRING ELECTRICITY
PERFORMING OPERATIONS
PORTABLE POWER-DRIVEN TOOLS
SEMICONDUCTOR DEVICES
STATIC ELECTRICITY
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FORFASTENING, CONNECTING, DISENGAGING OR HOLDING
TRANSPORTING
title Method and apparatus for releasing a semiconductor wafer from an electrostatic clamp
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