Method and apparatus for releasing a semiconductor wafer from an electrostatic clamp

A method and apparatus is provided for effectively releasing a semiconductor wafer (36) from a deactivated electrostatic clamp (20) by diffusing a neutralizing gas into the space between the clamping surface of the electrostatic clamp and the surface of the wafer, generating an ionizing voltage with...

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Bibliographische Detailangaben
Hauptverfasser:	ROBBINS, ROGER A
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CONVERSION OR DISTRIBUTION OF ELECTRIC POWER DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION HAND TOOLS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANIPULATORS METALLURGY NATURALLY-OCCURRING ELECTRICITY PERFORMING OPERATIONS PORTABLE POWER-DRIVEN TOOLS SEMICONDUCTOR DEVICES STATIC ELECTRICITY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FORFASTENING, CONNECTING, DISENGAGING OR HOLDING TRANSPORTING
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Beschreibung
Zusammenfassung:	A method and apparatus is provided for effectively releasing a semiconductor wafer (36) from a deactivated electrostatic clamp (20) by diffusing a neutralizing gas into the space between the clamping surface of the electrostatic clamp and the surface of the wafer, generating an ionizing voltage with an alternating polarity, and applying the alternating polarity ionizing voltage to the diffusing gas to neutralize the residual electrostatic charges remaining on the surfaces of the clamp (20) and the wafer (36).