Integrated circuit package having a liquid metal-aluminum/copper joint

An integrated circuit package includes an integrated circuit chip, a substrate which holds the chip, and a heat conduction mechanism which provides a path for conducting heat from the chip to a fluid medium; wherein the heat conduction mechanism is characterized as having a pressed joint which is comprised of: 1) a member that is made primarily of aluminum or copper, having a solid polysiloxane coating of less than 200 ANGSTROM thickness, and 2) a liquid metal alloy in contact with the coating. This solid coating, on the aluminum or copper member, is fabricated without any expensive equipment by the steps of: 1) forming a liquid coating of a polysiloxane solution on the aluminum or copper member; and 2) baking that member with its liquid coating at temperatures of 100 DEG C.-300 DEG C. for 0.5 hours-3.0 hours. Thereafter the integrated circuit package is completed by placing the member with its solid coat in the heat conducting path such that a liquid metal alloy is in contact with the solid coat.