Detachable apparatus for cooling integrated circuits

An apparatus for cooling an integrated circuit device has a fan detachably mounted to a heat sink, and the heat sink is in turn mounted to an exposed surface of the integrated circuit. The heat sink includes a pair of mounting posts, and the fan assembly includes corresponding mounting recesses for receiving the mounting posts. The mounting recesses are dimensioned to form an interference fit with the corresponding mounting posts, in order to retain the mounting posts within the mounting recesses. Alternatively, the fan assembly has biased tabs, which are received within corresponding recesses formed on the integrated circuit device to detachably mount the fan to the heat sink and integrated circuit. An electrical connector with biased terminals is mounted on the fan, and the biased terminals engage corresponding terminals on the integrated circuit upon mounting the fan to the heat sink.