Mounting apparatus for mounting chip component on mounting portion and method for controlling load on chip component

A collet for holding a die with a vacuum force is provided with a linear motor. At the time of bonding the die to a lead frame, a control unit controls the linear motor to mount the die, held by the collet, onto the mounting portion of the lead frame. At this time, the control unit gradually increas...

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Bibliographische Detailangaben
Hauptverfasser:	MISONO, HIROSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A collet for holding a die with a vacuum force is provided with a linear motor. At the time of bonding the die to a lead frame, a control unit controls the linear motor to mount the die, held by the collet, onto the mounting portion of the lead frame. At this time, the control unit gradually increases the torque of the linear motor to gradually press the die. This reduces the impact load applied to the die, preventing the die from being cracked.