Quick cure exhaust manifold

The invention is directed to a manifold 10 that is used in conjunction with a die attach cure station for providing a "quick cure" of the die mount adhesive, and for forcing contaminants away from the semiconductor die 33 surface. The manifold has an air put port 21 directly above the semi...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	NYE, LARRY W, HEAD, MICHAEL R, ROMM, DOUGLAS W
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING DRYING DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEATING LIGHTING MECHANICAL ENGINEERING SEMICONDUCTOR DEVICES WEAPONS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The invention is directed to a manifold 10 that is used in conjunction with a die attach cure station for providing a "quick cure" of the die mount adhesive, and for forcing contaminants away from the semiconductor die 33 surface. The manifold has an air put port 21 directly above the semiconductor die. Forced air is directed through the port. At each side of the forced port are vacuum ports 20,22 through which a vacuum is applied to draw air and heated die attach contaminants from the die surface. Air is also drawn from below and around the die mounting area to provide a stream of air that is drawn into the vacuum ports.