Clamp ring for domed pedestal in wafer processing chamber

A clamp ring for use in a thermal reactor for processing a semiconductor wafer. The reactor includes a domed pedestal for supporting the wafer and controlling its temperature, and a clamp ring which includes an annular seat formed therein, for receiving and holding down the periphery of the wafer on...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MOHN, JON, RICE, MICHAEL
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HAND TOOLS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANIPULATORS METALLURGY PERFORMING OPERATIONS PORTABLE POWER-DRIVEN TOOLS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FORFASTENING, CONNECTING, DISENGAGING OR HOLDING TRANSPORTING
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Beschreibung
Zusammenfassung:	A clamp ring for use in a thermal reactor for processing a semiconductor wafer. The reactor includes a domed pedestal for supporting the wafer and controlling its temperature, and a clamp ring which includes an annular seat formed therein, for receiving and holding down the periphery of the wafer onto the domed pedestal. The seat formed in the clamp ring supports a ring of spheres which, in operation, engage and hold down the periphery of the wafer. Each sphere is rotationally supported in a pocket formed in the body of the clamp ring. A portion of each sphere protrudes beyond the seat so that the wafer's surface is contacted by the convex surface of the sphere. This keeps the wafer's surface and any sharp edges on the seat apart, thereby reducing damage of the wafer's surface by the seat. As the spheres are able to rotate in the pockets and therefore roll on the surface of the wafer, the chances of the damaging the wafer's surface are further reduced.