Target cooling system with trough

Cathode sputtering apparatus includes a target, a cooling channel, and a flexible diaphragm therebetween. The target is fixed to a base independently of the diaphragm, so that the target can be replaced with disturbing the cooling channel. In a preferred embodiment, the diaphragm and the target are...

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Bibliographische Detailangaben
Hauptverfasser:	SCHILLING, HELMUT, JOOS, GERHARD, SCHUHMACHER, MANFRED
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	Cathode sputtering apparatus includes a target, a cooling channel, and a flexible diaphragm therebetween. The target is fixed to a base independently of the diaphragm, so that the target can be replaced with disturbing the cooling channel. In a preferred embodiment, the diaphragm and the target are fixed by respective sets of cleats retained by screws received from respective opposite directions.