High voltage resistive network circuit board with good potting adhesion

A thick film resistive network circuit board to be potted is given a surface coat of epoxy on one side which does not cover the solder pads or electrical connections, thereby allowing further working of the board. The epoxy coat is applied in such a fashion that it does not obscure or cover a second...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	WILTGEN, BERNARD M, LOSTUMO, ARTHUR J
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A thick film resistive network circuit board to be potted is given a surface coat of epoxy on one side which does not cover the solder pads or electrical connections, thereby allowing further working of the board. The epoxy coat is applied in such a fashion that it does not obscure or cover a second side of the board having a potentiometer network thereon in the preferred embodiment. The epoxy coat provides a good surface for adhesion of a potting epoxy as well as good adhesion to the board, and thereby prevents breakdown of the dielectric properties of the high voltage circuitry into which the board is fitted.