Method of forming a quantum multi-function semiconductor device

The present invention is a method of forming a quantum multi-function semiconductor device. In the method of the present invention, an insulating layer (12) is formed on a semiconductor substrate (11). An opening (14) is formed in the insulating layer (12), and a channel region (15) is formed in the...

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Bibliographische Detailangaben
Hauptverfasser:	TSUI, RAYMOND K
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	The present invention is a method of forming a quantum multi-function semiconductor device. In the method of the present invention, an insulating layer (12) is formed on a semiconductor substrate (11). An opening (14) is formed in the insulating layer (12), and a channel region (15) is formed in the opening (14). A channel layer (21) is formed over the channel region (15). An opening (23) is formed through the channel layer (21) such that a portion of the opening is over a portion of the channel region (15). A source electrode (28) is formed to contact a channel layer (17) of the channel region (15), a drain electrode (29) is formed to contact the channel layer (21), and a gate electrode (31) is formed to contact the second barrier layer (27).