Enclosure for humidity sensing element

An enclosure for a film-type humidity sensing element includes identical enclosure members which snap together to form an enclosure with the humidity sensing element sandwiched between the members, each of the members including a lead mounting area on its inner surface for mounting the mounting ends of electrical leads, the leads being connected to contact portions of the humidity sensing element interiorly of the enclosure by a metal-filled conductive adhesive which is introduced into the enclosure through access openings after the enclosure members have been assembled together. The enclosure is adapted for mounting on a circuit board in both horizontal and vertical orientations and independently of the lead structure of the sensor assembly.