Module cooling system

An apparatus is provided for cooling electronic components mounted on a circuit board. The circuit board is placed in thermal contact with a heat sink enclosure that has an interior cavity and a release opening that provides a path from the interior cavity to the external ambient. A meltable pellet...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	ALTOZ, FRANK E
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS SEMICONDUCTOR DEVICES WEAPONS
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Beschreibung
Zusammenfassung:	An apparatus is provided for cooling electronic components mounted on a circuit board. The circuit board is placed in thermal contact with a heat sink enclosure that has an interior cavity and a release opening that provides a path from the interior cavity to the external ambient. A meltable pellet blocks the release opening. A wick is bonded to the inside surface of the interior cavity. The device is sealed with a working fluid that permeates the wick. When the components get hot, the heat is transferred through the heat sink enclosure to the working fluid in the wick, causing the working fluid to vaporize. The vapors remain trapped in the interior cavity until the pellet melts, allowing the vapor to be released and the temperature of the heat sink enclosure to be stabilized or lowered.